TES1-7102,03 TEC1-7102,03,04,06 Peltier Module 23x23mm 30x30mm Small Power Thermoelectric Cooler TEC Chip Mini Cooling Plate

This is a small-power single-stage thermoelectric Peltier cooling chip (TEC module) built on the Peltier effect, supplied in two physical sizes (23×23mm & 30×30mm) across six industrial standard models: TES1-7102, TES1-7103, TEC1-7102, TEC1-7103, TEC1-7104, TEC1-7106. It uses bismuth telluride semiconductor pellets sandwiched between durable alumina ceramic substrates, delivering silent solid-state cooling or heating without compressors or refrigerant gas.

Product Information

Item	Full Details
Product Name	Small Power Thermoelectric Cooler Peltier Module
Available Models	TES1-7102, TES1-7103 (23×23mm); TEC1-7102, TEC1-7103, TEC1-7104, TEC1-7106 (30×30mm)
Core Raw Material	High-purity Bismuth Telluride thermoelectric pellets, Al₂O₃ Alumina ceramic top/bottom substrates, copper conductive strips, tinned copper lead wires
Physical Dimensions	23×23mm (TES1 series), 30×30mm (TEC1 series); thickness ~3.3–4.2mm
Working Principle	Peltier effect; DC input creates cold absorption side & hot heat dissipation side; polarity reversal swaps cooling/heating mode
Construction Type	Solid-state sealed single-stage thermoelectric chip, no moving mechanical parts

How to select from TES1-7102 / TES1-7103 / TEC1-7102 / TEC1-7103 / TEC1-7104 / TEC1-7106

All 6 models belong to the single-stage 71 thermocouple pair Peltier cooling series. The core split is TES = 23×23mm compact miniature size vs TEC = 30×30mm standard medium size. Suffix digits (02/03/04/06) define max operating current, cooling power and power supply requirements; higher suffix numbers deliver stronger cooling performance with higher power draw.

Model Naming Rule Breakdown

1. Prefix Code (Core Size Difference)

• TES: Mini compact module, physical dimension = 23×23mm, thinner ceramic substrate, low-power miniature design for tiny electronics
• TEC: Standard medium module, physical dimension = 30×30mm, thicker heat transfer layer, higher heat load capacity
• 1: Single-stage cooling structure (all these are single-layer, not multi-stage)
• 71: Fixed 71 pairs of bismuth telluride thermoelectric pellets (all 6 models share identical internal pellet count)
• Suffix 02 / 03 / 04 / 06: Max operating current (Imax) identifier, directly determines cooling power

Full Parameter Comparison

Model	Overall Size	Max Current (Imax)	Max Voltage (Vmax)	Max Cooling Power Qcmax	Max ΔT Temperature Difference	Core Application Trait
TES1-7102	23×23mm	2A	8V	~9.5W	60–65°C	Ultra-low power, micro compact
TES1-7103	23×23mm	3A	8V	~14.2W	60–65°C	Mid-low power tiny cooling
TEC1-7102	30×30mm	2A	8V	~9.9W	63–66°C	Standard size low-power
TEC1-7103	30×30mm	3A	8V	~14.8W	63–66°C	Standard size mid cooling
TEC1-7104	30×30mm	4A	8V	~19.6W	63–66°C	Standard size high cooling
TEC1-7106	30×30mm	6A	8V	~29.5W	63–66°C	Highest cooling power of this series

Key Core Differences Between All Models

Difference 1: Physical Size (TES vs TEC Prefix)

• TES1-7102 / TES1-7103: 23×23mm miniature footprint, smaller contact surface, only fit ultra-compact enclosures (laser diodes, beauty facial mini chillers, tiny sensor cooling). Limited total heat transfer volume, so maximum cooling power caps at ~14.2W.
• TEC1-7102 / 7103 / 7104 / 7106: 30×30mm larger square surface, bigger ceramic contact area for heatsink bonding, better heat dissipation tolerance, can sustain higher current and carry more cooling load for medium-size cooling projects.

Difference 2: Suffix Number = Maximum Current & Cooling Capacity

All models share the same 8.4V max voltage; performance only scales with suffix digit:

1. Suffix 02 (2A): Lowest power consumption, minimal heat generation on hot side, works well with small lightweight heatsinks, ideal for low-heat-load precision temperature stabilization
2. Suffix 03 (3A): Balanced power and size, the most universal mid-tier choice for small portable cooling devices
3. Suffix 04 (4A): Higher cooling output, requires medium-sized heatsink + fan assembly, suitable for small dehumidifiers, insulin mini coolers
4. Suffix 06 (6A): Peak cooling power of the 71-pair series, mandatory heavy-duty aluminum heatsink with cooling fan; used for higher heat load electronics cooling

Difference 3: Operating Efficiency & Heat Dissipation Requirement

• 23×23mm TES modules: Higher thermal resistance due to smaller ceramic area; must use compact thin heatsinks, cannot handle continuous high-current operation without overheating
• 30×30mm TEC modules: Lower thermal resistance, wider heat exchange surface, stable long-duration operation at full rated current, wider compatibility with aftermarket cooling hardware

Application Scenarios

TES1-7102 (23×23mm, 2A)

Mini laser diode cooling, small infrared sensor temperature stabilizer, portable cosmetic eye cryotherapy tools, tiny lab test probes

TES1-7103 (23×23mm, 3A)

Mini facial beauty cold hammer, small handheld beverage chillers, miniature camera sensor cooling

TEC1-7102 (30×30mm, 2A)

Low-power medical sample storage boxes, compact CPU chip hotspot cooling, small dehumidifier prototypes with low moisture load

TEC1-7103 (30×30mm, 3A)

Portable car mini refrigerators, desktop water cup chillers, insulin travel cooling boxes (most popular universal variant)

TEC1-7104 (30×30mm, 4A)

Small household dehumidifier modules, compact lab reagent temperature control units, high-heat LED lamp cooling

TEC1-7106 (30×30mm, 6A)

Medium-volume DIY mini fridge, industrial precision electronic component cooling, small incubator temperature regulation

Quick Selection Guidance

1. If your installation space is extremely limited (<25mm width): Choose TES1-7102 / TES1-7103
2. If you need stronger cooling and have space for a 30mm heatsink: Pick TEC series
3. Low power budget / small battery-powered devices: Select suffix 02
4. Balanced cooling & power draw for consumer portable goods: Select suffix 03
5. Higher cooling demand with standard power supply: Select suffix 04
6. Max cooling performance for fixed mains-powered equipment: Select suffix 06